Repeatability of stage measurement: 0.08% 1σ
details
Dedicated Functions for Semiconductor Field
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Measure profile trenches after laser grooving in the dicing process.
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Measure film step-height of wafer ranging from 1nm~1mm.
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Measure roughness of silicon cut sheet after grinding process, and can measure
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dozens of small areas to obtain the average value by one click.
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Support 6", 8" and 12" wafer measurement, and easy switch between 3 sizes of
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vacuum chucks by one click automatically.
Description
SuperView W3 Optical 3D Surface profilometer is an ideal instrument for sub-Nanometer measurement of various precision parts. Based on the principle of white light interference technology, combined with precision Z-direction scanning module and 3D modeling algorithm, it contactlessly scans the surface of the object then establish a 3D image for the surface. A serial of 2D, 3D parameters reflecting surface quality of the object are obtained after XtremeVision software processes and analyzes the 3D image. The SuperView W3 is a user-friendly precision optical instrument with powerful analysis functions for all kinds of surface form & roughness parameters. With unique light source it could measure various precision parts with both smooth and rough surface.

Parameters
|
Model No. |
SuperView W3 |
|
Size |
1000*900*1550mm |
|
Weight |
500 kg |
|
Light source |
White LED |
|
Video system |
1024×1024 |
|
Objective Lens |
10x(2.5x,5x,20x,50x,100x optional) |
|
Optical Zoom |
0.5x(0.75x,1x,0.375x optional) |
|
Standard F.O.V. |
0.98×0.98 mm |
|
Lens Turret |
Motorized 5 holes-turret |
|
XY Object table |
Size |
450×450mm |
|
Travel Range |
300×300mm |
|
Loading Capacity |
10kg |
|
Control Method |
Motorized |
|
Tilt |
±5° Motorized |
|
Z Axis |
Travel Range |
100mm |
|
Control Method |
Motorized |
|
Z-Stoke Scanning Range |
10mm |
|
Z Resolution |
0.1nm |
|
Roughness RMS Repeatability *1 |
0.005nm |
|
Stage Height Measurement |
Accruacy *2 |
0.3% |
|
Repeatability *2 |
0.08% 1σ |
|
Enviromental Requirement
|
|
1 |
Operating environment: No strong magnetic field |
4 |
Environmental vibration: VC-C or better |
|
2 |
Working temperature: 0 °C~30°C fluctuation <2℃/60min |
5 |
Compressed air: 0.6Mpa oil-free, water-free |
|
3 |
Relative humidity: 5%~95% RH, no condensation |
6 |
Power: 300W |
Remark:
*1 Measure Sa 0.2nm silicon wafer in a laboratory environment according to the ISO 25178
*2 Measure standard 5 μm steps height block in a laboratory environment according to the ISO 10610-1:2009
Applications
It is used for measurement and analysis of surface roughness and profile of precision components from industries of semi-conductor, 3C Electronics, ultraprecise machining, optical machining, micro-nano materials, micro-electro-mechanical system.

Measurement and analysis for various products, components and materials`surface form and profile characteristics, such as flatness, roughness, waviness, appearance, surface defect, abrasion,corrosion, gap, hole, stage, curvature, deformation, etc.